Assignee
WANG CHIN-SHENG
TW·4 granted patents·3 pending applications·14 citations·filing 2011–2014
Top patents by PatentIndex Score
7 records- 0190US8859908B2Package carrierWANG CHIN-SHENG·Filed 2013·Granted Oct 14, 2014·14 cites·12 claims
- 0252US2012175044A1Manufacturing method of thermal conductivity substrateWANG CHIN-SHENG·Filed 2012·Application pending·0 cites
- 0350US9282643B2Core substrate and method for fabricating circuit boardWANG CHIN-SHENG·Filed 2014·Granted Mar 8, 2016·0 cites·6 claims
- 0450US2012070684A1Thermal conductivity substrate and manufacturing method thereofWANG CHIN-SHENG·Filed 2011·Application pending·0 cites
- 0549US9204546B2Circuit board and manufacturing method thereofWANG CHIN-SHENG·Filed 2014·Granted Dec 1, 2015·0 cites·17 claims
- 0642US9433099B2Package carrierWANG CHIN-SHENG·Filed 2013·Granted Aug 30, 2016·0 cites·9 claims
- 0734US2013329386A1Package carrier and manufacturing method thereofWANG CHIN-SHENG·Filed 2012·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →