Assignee
WANG CHUNG-YU
TW·12 granted patents·1 pending application·340 citations·filing 2007–2012
Top patents by PatentIndex Score
13 records- 0198US8183579B2LED flip-chip package structure with dummy bumpsWANG CHUNG YU·Filed 2010·Granted May 22, 2012·133 cites·15 claims
- 0298US8183578B2Double flip-chip LED package componentsWANG CHUNG YU·Filed 2010·Granted May 22, 2012·136 cites·20 claims
- 0395US8580683B2Apparatus and methods for molding die on wafer interposersWANG CHUNG YU·Filed 2011·Granted Nov 12, 2013·20 cites·16 claims
- 0490US8390009B2Light-emitting diode (LED) package systemsWANG CHUNG YU·Filed 2010·Granted Mar 5, 2013·11 cites·19 claims
- 0589US8501590B2Apparatus and methods for dicing interposer assemblyWANG CHUNG YU·Filed 2011·Granted Aug 6, 2013·8 cites·16 claims
- 0685US8399269B2LED flip-chip package structure with dummy bumpsWANG CHUNG-YU·Filed 2012·Granted Mar 19, 2013·6 cites·21 claims
- 0784US8492263B2Protected solder ball joints in wafer level chip-scale packagingWANG CHUNG YU·Filed 2007·Granted Jul 23, 2013·11 cites·13 claims
- 0883US8900893B2Vertical LED chip package on TSV carrierWANG CHUNG YU·Filed 2010·Granted Dec 2, 2014·6 cites·20 claims
- 0982US8183580B2Thermally-enhanced hybrid LED package componentsWANG CHUNG YU·Filed 2010·Granted May 22, 2012·6 cites·20 claims
- 1067US8816495B2Structures and formation methods of packages with heat sinksWANG CHUNG YU·Filed 2012·Granted Aug 26, 2014·2 cites·16 claims
- 1160US8642390B2Tape residue-free bump area after wafer back grindingWANG CHUNG YU·Filed 2010·Granted Feb 4, 2014·1 cites·20 claims
- 1252US2012204951A1Phosphor-contained solar cell and method thereofWANG CHUNG-YU·Filed 2011·Application pending·0 cites
- 1343US8629043B2Methods for de-bonding carriersWANG CHUNG YU·Filed 2011·Granted Jan 14, 2014·0 cites·19 claims
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