Assignee
WANG DAVID WEI
TW·5 granted patents·2 pending applications·43 citations·filing 2006–2011
Top patents by PatentIndex Score
7 records- 0188US8269352B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 18, 2012·10 cites·13 claims
- 0287US8469109B2Deformable dart and methodWANG DAVID WEI·Filed 2010·Granted Jun 25, 2013·12 cites·20 claims
- 0377US8752635B2Downhole wet mate connectionWANG DAVID WEI·Filed 2006·Granted Jun 17, 2014·17 cites·9 claims
- 0468US8269351B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 18, 2012·2 cites·11 claims
- 0568US8264068B2Multi-chip stack package structureWANG DAVID WEI·Filed 2011·Granted Sep 11, 2012·2 cites·9 claims
- 0644US2011291268A1Semiconductor wafer structure and multi-chip stack structureWANG DAVID WEI·Filed 2010·Application pending·0 cites
- 0744US2011291267A1Semiconductor wafer structure and multi-chip stack structureWANG DAVID WEI·Filed 2010·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →