Assignee
WANG KEN JIAN MING
US·2 granted patents·1 pending application·2 citations·filing 2007–2007
Top patents by PatentIndex Score
3 records- 0158US8193613B2Semiconductor die having increased usable areaWANG KEN JIAN MING·Filed 2007·Granted Jun 5, 2012·2 cites·19 claims
- 0241US8269321B2Low cost lead frame package and method for forming sameWANG KEN JIAN MING·Filed 2007·Granted Sep 18, 2012·0 cites·19 claims
- 0340US2008220206A1Semiconductor die for increasing yield and usable wafer areaWANG KEN JIAN MING·Filed 2007·Application pending·0 cites
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