Assignee
WANG TSUNG-DING
TW·8 granted patents·112 citations·filing 2010–2012
Top patents by PatentIndex Score
8 records- 0197US9275924B2Semiconductor package having a recess filled with a molding compoundWANG TSUNG-DING·Filed 2012·Granted Mar 1, 2016·64 cites·19 claims
- 0295US8823180B2Package on package devices and methods of packaging semiconductor diesWANG TSUNG-DING·Filed 2012·Granted Sep 2, 2014·30 cites·18 claims
- 0389US8743561B2Wafer-level molded structure for package assemblyWANG TSUNG-DING·Filed 2010·Granted Jun 3, 2014·9 cites·8 claims
- 0478US8597986B2System in package and method of fabricating sameWANG TSUNG-DING·Filed 2011·Granted Dec 3, 2013·4 cites·20 claims
- 0569US8987605B2Formation of connectors without UBMWANG TSUNG-DING·Filed 2011·Granted Mar 24, 2015·2 cites·19 claims
- 0668US10163877B2System in package process flowWANG TSUNG DING·Filed 2011·Granted Dec 25, 2018·2 cites·20 claims
- 0760US9935038B2Semiconductor device packages and methodsWANG TSUNG DING·Filed 2012·Granted Apr 3, 2018·1 cites·20 claims
- 0842US9881898B2System in package process flowWANG TSUNG-DING·Filed 2012·Granted Jan 30, 2018·0 cites·20 claims
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