Assignee
WANG ZHIJIE
CN·5 granted patents·17 citations·filing 2014–2015
Top patents by PatentIndex Score
5 records- 0188US9406625B2Die edge seal employing low-K dielectric materialWANG ZHIJIE·Filed 2014·Granted Aug 2, 2016·14 cites·17 claims
- 0286US9397066B2Bond wire feed system and method thereforWANG ZHIJIE·Filed 2015·Granted Jul 19, 2016·3 cites·18 claims
- 0344US9498898B2Cleaning mechanism for semiconductor singulation sawsWANG ZHIJIE·Filed 2014·Granted Nov 22, 2016·0 cites·16 claims
- 0444US9252114B2Semiconductor device grid array packageWANG ZHIJIE·Filed 2014·Granted Feb 2, 2016·0 cites·16 claims
- 0541US9214413B2Semiconductor die package with pre-molded dieWANG ZHIJIE·Filed 2014·Granted Dec 15, 2015·0 cites·17 claims
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