Assignee
WARREN ROBERT W
US·13 granted patents·8 pending applications·134 citations·filing 2007–2013
Top patents by PatentIndex Score
21 records- 0194US8174912B2Systems and methods for circular buffering control in a memory deviceWARREN ROBERT W·Filed 2010·Granted May 8, 2012·23 cites·20 claims
- 0293US8499220B2Systems and methods for re-designating memory regions as error code corrected memory regionsWARREN ROBERT W·Filed 2010·Granted Jul 30, 2013·21 cites·20 claims
- 0391US8560765B2Systems and methods for variable level use of a multi-level flash memoryWARREN ROBERT W·Filed 2010·Granted Oct 15, 2013·16 cites·31 claims
- 0489US8458416B2Systems and methods for selecting bit per cell density of a memory cell based on data typingWARREN ROBERT W·Filed 2010·Granted Jun 4, 2013·21 cites·20 claims
- 0588US8455990B2Systems and methods of tamper proof packaging of a semiconductor deviceWARREN ROBERT W·Filed 2010·Granted Jun 4, 2013·11 cites·23 claims
- 0686US8289768B2Systems and methods for extended life multi-bit memory cellsWARREN ROBERT W·Filed 2010·Granted Oct 16, 2012·19 cites·20 claims
- 0782US9029991B2Semiconductor packages with reduced solder voidingWARREN ROBERT W·Filed 2010·Granted May 12, 2015·7 cites·19 claims
- 0870US8552540B2Wafer level package with thermal pad for higher power dissipationWARREN ROBERT W·Filed 2011·Granted Oct 8, 2013·3 cites·6 claims
- 0965US8243546B2Systems and methods for peak power and/or EMI reductionWARREN ROBERT W·Filed 2010·Granted Aug 14, 2012·3 cites·20 claims
- 1064US8301195B2Systems and methods for mobile data storage and acquisitionWARREN ROBERT W·Filed 2007·Granted Oct 30, 2012·6 cites·25 claims
- 1161US8540529B2Shielded USB connector module with molded hood and LED light pipeWARREN ROBERT W·Filed 2011·Granted Sep 24, 2013·4 cites·20 claims
- 1246US2013208424A1Solid via pins for improved thermal and electrical conductivityWARREN ROBERT W·Filed 2013·Application pending·0 cites
- 1342US9230928B2Spot plated leadframe and IC bond pad via array design for copper wireWARREN ROBERT W·Filed 2011·Granted Jan 5, 2016·0 cites·9 claims
- 1438US2009193178A1Systems and methods for power management in relation to a wireless storage deviceWARREN ROBERT W·Filed 2007·Application pending·0 cites
- 1538US2013087915A1Copper Stud Bump Wafer Level PackageWARREN ROBERT W·Filed 2011·Application pending·0 cites
- 1637US8243536B2Systems and methods for increasing bit density in a memory cellWARREN ROBERT W·Filed 2010·Granted Aug 14, 2012·0 cites·24 claims
- 1737US2012326304A1Externally Wire Bondable Chip Scale Package in a System-in-Package ModuleWARREN ROBERT W·Filed 2011·Application pending·0 cites
- 1836US2012104591A1Systems and methods for improved heat dissipation in semiconductor packagesWARREN ROBERT W·Filed 2010·Application pending·0 cites
- 1936US2012032350A1Systems and Methods for Heat Dissipation Using Thermal ConduitsWARREN ROBERT W·Filed 2010·Application pending·0 cites
- 2036US2012241954A1Unpackaged and packaged IC stacked in a system-in-package moduleWARREN ROBERT W·Filed 2011·Application pending·0 cites
- 2136US2012188738A1Integrated led in system-in-package moduleWARREN ROBERT W·Filed 2011·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →