Assignee
WATANABE MASAKAZU
JP·2 granted patents·0 citations·filing 2010–2013
Top patents by PatentIndex Score
2 records- 0136US9293555B2Semiconductor device and manufacturing method of sameWATANABE MASAKAZU·Filed 2013·Granted Mar 22, 2016·0 cites·2 claims
- 0226US8633511B2Method of producing semiconductor device packaging having chips attached to islands separately and covered by encapsulation materialWATANABE MASAKAZU·Filed 2010·Granted Jan 21, 2014·0 cites·6 claims
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