Assignee

WEN YENTING

US·1 granted patent·1 pending application·4 citations·filing 2007–2010

Technology mixH10W2

Top patents by PatentIndex Score

2 records

0168US8582317B2Method for manufacturing a semiconductor component and structure thereforWEN YENTING·Filed 2010·Granted Nov 12, 2013·4 cites·16 claims
0233US2009057822A1Semiconductor component and method of manufactureWEN YENTING·Filed 2007·Application pending·0 cites

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