Assignee
WEST JEFFREY ALAN
US·7 granted patents·129 citations·filing 2009–2011
Top patents by PatentIndex Score
7 records- 0195US8298944B1Warpage control for die with protruding TSV tips during thermo-compressive bondingWEST JEFFREY ALAN·Filed 2011·Granted Oct 30, 2012·36 cites·20 claims
- 0294US8097964B2IC having TSV arrays with reduced TSV induced stressWEST JEFFREY ALAN·Filed 2009·Granted Jan 17, 2012·39 cites·17 claims
- 0389US8575758B2Laser-assisted cleaving of a reconstituted wafer for stacked die assembliesWEST JEFFREY ALAN·Filed 2011·Granted Nov 5, 2013·10 cites·9 claims
- 0485US8227839B2Integrated circuit having TSVS including hillock suppressionWEST JEFFREY ALAN·Filed 2010·Granted Jul 24, 2012·9 cites·13 claims
- 0583US8912076B2Crack deflector structure for improving semiconductor device robustness against saw-induced damageWEST JEFFREY ALAN·Filed 2009·Granted Dec 16, 2014·11 cites·12 claims
- 0683US8125054B2Semiconductor device having enhanced scribe and method for fabricationWEST JEFFREY ALAN·Filed 2009·Granted Feb 28, 2012·20 cites·20 claims
- 0777US8623763B2Protective layer for protecting TSV tips during thermo-compressive bondingWEST JEFFREY ALAN·Filed 2011·Granted Jan 7, 2014·4 cites·32 claims
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