Assignee
WHANG TSUNG CHUAN
US·2 granted patents·11 citations·filing 2014–2015
Top patents by PatentIndex Score
2 records- 0183US9349610B2Assembly structure for connecting multiple dies into a system-in-package chip and the method thereofWHANG TSUNG CHUAN·Filed 2015·Granted May 24, 2016·5 cites·10 claims
- 0281US9111846B1Assembly structure for connecting multiple dies into a system-in-package chip and the method thereofWHANG TSUNG CHUAN·Filed 2014·Granted Aug 18, 2015·6 cites·15 claims
Join the waitlist — get patent alerts
Get an alert when WHANG TSUNG CHUAN files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →