Assignee
WRIGHT JASON R
US·1 granted patent·1 pending application·5 citations·filing 2011–2013
Top patents by PatentIndex Score
2 records- 0175US9025340B2Devices and stacked microelectronic packages with in-trench package surface conductors and methods of their fabricationWRIGHT JASON R·Filed 2013·Granted May 5, 2015·5 cites·4 claims
- 0235US2013154091A1Semiconductor device packaging using encapsulated conductive balls for package-on-package back side couplingWRIGHT JASON R·Filed 2011·Application pending·0 cites
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