Assignee
WU CHARLES HUNG-HSIANG
US·2 granted patents·14 citations·filing 2010–2012
Top patents by PatentIndex Score
2 records- 0178US8399298B2Rule-based semiconductor die stacking and bonding within a multi-die packageWU CHARLES HUNG-HSIANG·Filed 2012·Granted Mar 19, 2013·8 cites·27 claims
- 0274US8158457B2Rule-based semiconductor die stacking and bonding within a multi-die packageWU CHARLES HUNG-HSIANG·Filed 2010·Granted Apr 17, 2012·6 cites·33 claims
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