Assignee
WU EPHREM C
US·6 granted patents·361 citations·filing 2003–2012
Top patents by PatentIndex Score
6 records- 0198US8546955B1Multi-die stack packageWU EPHREM C·Filed 2012·Granted Oct 1, 2013·259 cites·20 claims
- 0297US8704384B2Stacked die assemblyWU EPHREM C·Filed 2012·Granted Apr 22, 2014·71 cites·20 claims
- 0393US8514634B1Multi-protocol gearboxWU EPHREM C·Filed 2011·Granted Aug 20, 2013·20 cites·20 claims
- 0473US7349387B2Digital cross-connectWU EPHREM C·Filed 2003·Granted Mar 25, 2008·10 cites·34 claims
- 0561US8417867B2Multichip module for communicationsWU EPHREM C·Filed 2010·Granted Apr 9, 2013·1 cites·18 claims
- 0633US8611175B2Contention-free memory arrangementWU EPHREM C·Filed 2011·Granted Dec 17, 2013·0 cites·20 claims
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