Assignee
XIAMEN CHANGELIGHT CO LTD
CN·18 granted patents·8 pending applications·12 citations·filing 2014–2024
Top patents by PatentIndex Score
26 records- 0184US11621375B2Light-emitting diode chip and method of manufacturing the sameXIAMEN CHANGELIGHT CO LTD·Filed 2017·Granted Apr 4, 2023·4 cites·17 claims
- 0280US10043850B2HV-LED module having 3D light-emitting structure and manufacturing method thereofXIAMEN CHANGELIGHT CO LTD·Filed 2016·Granted Aug 7, 2018·5 cites·15 claims
- 0376US10121656B2Buffer layers having composite structuresXIAMEN CHANGELIGHT CO LTD·Filed 2017·Granted Nov 6, 2018·2 cites·20 claims
- 0464US11456399B2Light emitting diode (LED) chip and manufacturing method and light emitting method thereofXIAMEN CHANGELIGHT CO LTD·Filed 2018·Granted Sep 27, 2022·1 cites·4 claims
- 0564US2024421263A1Led chip and led chip preparation methodXIAMEN CHANGELIGHT CO LTD·Filed 2024·Application pending·0 cites
- 0660US2023361245A1Semiconductor epitaxy structure, manufacturing method thereof, and led chipXIAMEN CHANGELIGHT CO LTD·Filed 2023·Application pending·0 cites
- 0760US2024038938A1Light-emitting structure, manufacturing method thereof, and light-emitting deviceXIAMEN CHANGELIGHT CO LTD·Filed 2023·Application pending·0 cites
- 0860US2023352623A1Semiconductor epitaxy structure and manufacturing method therefor, and led chipXIAMEN CHANGELIGHT CO LTD·Filed 2023·Application pending·0 cites
- 0958US2024128403A1Micro light emitting element and its preparation methodXIAMEN CHANGELIGHT CO LTD·Filed 2023·Application pending·0 cites
- 1054US12310153B2Mini light-emitting diode chip having an extended electrode facing away from a growth substrate and manufacturing method thereofXIAMEN CHANGELIGHT CO LTD·Filed 2022·Granted May 20, 2025·0 cites·20 claims
- 1152US10916422B2Buffer layers having composite structuresXIAMEN CHANGELIGHT CO LTD·Filed 2018·Granted Feb 9, 2021·0 cites·20 claims
- 1251US2022393077A1Flip light emitting chip and manufacturing method thereofXIAMEN CHANGELIGHT CO LTD·Filed 2022·Application pending·0 cites
- 1350US11328924B2Semiconductor wafer and method for manufacturing semiconductor wafer thereofXIAMEN CHANGELIGHT CO LTD·Filed 2020·Granted May 10, 2022·0 cites·6 claims
- 1450US10468550B2Light-emiting diode device and method of producing the sameXIAMEN CHANGELIGHT CO LTD·Filed 2018·Granted Nov 5, 2019·0 cites·20 claims
- 1546US11695098B2High voltage light-emitting diode and method of producing the sameXIAMEN CHANGELIGHT CO LTD·Filed 2019·Granted Jul 4, 2023·0 cites·8 claims
- 1646US11201260B2Semiconductor chip of light emitting diode having quantum well layer stacked on N-type gallium nitride layerXIAMEN CHANGELIGHT CO LTD·Filed 2019·Granted Dec 14, 2021·0 cites·19 claims
- 1744US11469349B2Semiconductor chip of light emitting diode and manufacturing method thereofXIAMEN CHANGELIGHT CO LTD·Filed 2019·Granted Oct 11, 2022·0 cites·20 claims
- 1842US11616171B2Flip light emitting chip and manufacturing method thereofXIAMEN CHANGELIGHT CO LTD·Filed 2019·Granted Mar 28, 2023·0 cites·25 claims
- 1942US10333028B2Light-emitting diode chips with enhanced brightnessXIAMEN CHANGELIGHT CO LTD·Filed 2017·Granted Jun 25, 2019·0 cites·13 claims
- 2041US11527679B2Semiconductor light emitting chip and its manufacturing methodXIAMEN CHANGELIGHT CO LTD·Filed 2019·Granted Dec 13, 2022·0 cites·33 claims
- 2141US10937926B2Light-emitting diodes with buffer layersXIAMEN CHANGELIGHT CO LTD·Filed 2017·Granted Mar 2, 2021·0 cites·10 claims
- 2239US10658541B2Selective growth of nitride buffer layerXIAMEN CHANGELIGHT CO LTD·Filed 2018·Granted May 19, 2020·0 cites·20 claims
- 2339US10622339B2Methods and display devices for micro-LED mass transfer processesXIAMEN CHANGELIGHT CO LTD·Filed 2018·Granted Apr 14, 2020·0 cites·19 claims
- 2437US11621380B2Flip-chip of light emitting diode and manufacturing method and illuminating method thereofXIAMEN CHANGELIGHT CO LTD·Filed 2018·Granted Apr 4, 2023·0 cites·16 claims
- 2537US2015016116A1Flexible led light bar and manufacturing method thereofXIAMEN CHANGELIGHT CO LTD·Filed 2014·Application pending·0 cites
- 2634US2017256403A1Method of Manufacturing Buffer Layers Having Composite StructuresXIAMEN CHANGELIGHT CO LTD·Filed 2017·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →