Assignee
XINTEC INC
TW·188 granted patents·65 pending applications·282 citations·filing 2007–2025
Top patents by PatentIndex Score
253 records- 0197US11521938B2Chip package including substrate inclined sidewall and redistribution lineXINTEC INC·Filed 2021·Granted Dec 6, 2022·3 cites·13 claims
- 0296US10109559B2Electronic device package and fabrication method thereofXINTEC INC·Filed 2014·Granted Oct 23, 2018·29 cites·19 claims
- 0396US8741683B2Chip package and fabrication method thereofXINTEC INC·Filed 2013·Granted Jun 3, 2014·24 cites·12 claims
- 0495US12341109B2Chip package and manufacturing method thereofXINTEC INC·Filed 2023·Granted Jun 24, 2025·1 cites·18 claims
- 0595US11309271B2Chip structure and manufacturing method thereofXINTEC INC·Filed 2020·Granted Apr 19, 2022·4 cites·21 claims
- 0691US8952501B2Chip package and method for forming the sameXINTEC INC·Filed 2013·Granted Feb 10, 2015·14 cites·27 claims
- 0790US8963312B2Stacked chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Feb 24, 2015·11 cites·23 claims
- 0889US11973095B2Method for forming chip package with second opening surrounding first opening having conductive structure thereinXINTEC INC·Filed 2022·Granted Apr 30, 2024·1 cites·19 claims
- 0989US8552547B2Electronic device package and method for forming the sameXINTEC INC·Filed 2013·Granted Oct 8, 2013·7 cites·7 claims
- 1088US8872196B2Chip packageXINTEC INC·Filed 2012·Granted Oct 28, 2014·5 cites·20 claims
- 1187US8803326B2Chip packageXINTEC INC·Filed 2012·Granted Aug 12, 2014·7 cites·22 claims
- 1286US11784134B2Chip package and manufacturing method thereofXINTEC INC·Filed 2021·Granted Oct 10, 2023·1 cites·9 claims
- 1386US11505457B2Semiconductor removing apparatus and operation method thereofXINTEC INC·Filed 2022·Granted Nov 22, 2022·2 cites·15 claims
- 1486US10056419B2Chip package having chip connected to sensing device with redistribution layer in insulator layerXINTEC INC·Filed 2018·Granted Aug 21, 2018·4 cites·20 claims
- 1585US9633935B2Stacked chip package including substrate with recess adjoining side edge of substrate and method for forming the sameXINTEC INC·Filed 2015·Granted Apr 25, 2017·5 cites·24 claims
- 1684US10446504B2Chip package and method for forming the sameXINTEC INC·Filed 2018·Granted Oct 15, 2019·5 cites·20 claims
- 1784US9935148B2Method for forming chip package having chip connected to sensing device with redistribution layer in insulator layerXINTEC INC·Filed 2016·Granted Apr 3, 2018·4 cites·20 claims
- 1884US9355975B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted May 31, 2016·6 cites·18 claims
- 1983US9362134B2Chip package and fabrication method thereofXINTEC INC·Filed 2014·Granted Jun 7, 2016·5 cites·12 claims
- 2083US8772932B2Electronic device packageXINTEC INC·Filed 2012·Granted Jul 8, 2014·4 cites·5 claims
- 2182US10157875B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted Dec 18, 2018·4 cites·34 claims
- 2281US10050006B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Aug 14, 2018·3 cites·10 claims
- 2381US8716109B2Chip package and fabrication method thereofXINTEC INC·Filed 2013·Granted May 6, 2014·4 cites·14 claims
- 2480US11749618B2Chip package including substrate having through hole and redistribution lineXINTEC INC·Filed 2022·Granted Sep 5, 2023·0 cites·14 claims
- 2580US9543233B2Chip package having a dual through hole redistribution layer structureXINTEC INC·Filed 2015·Granted Jan 10, 2017·3 cites·9 claims
- 2680US8860217B1Electronic device packageXINTEC INC·Filed 2014·Granted Oct 14, 2014·3 cites·9 claims
- 2779US12473197B2Chip packageXINTEC INC·Filed 2023·Granted Nov 18, 2025·0 cites·19 claims
- 2879US11942563B1Manufacturing method of chip package and chip packageXINTEC INC·Filed 2023·Granted Mar 26, 2024·0 cites·10 claims
- 2978US11450697B2Chip package with substrate having first opening surrounded by second opening and method for forming the sameXINTEC INC·Filed 2019·Granted Sep 20, 2022·2 cites·13 claims
- 3078US9704772B2Chip package and method for forming the sameXINTEC INC·Filed 2016·Granted Jul 11, 2017·2 cites·20 claims
- 3178US9196571B2Chip device packages and fabrication methods thereofXINTEC INC·Filed 2015·Granted Nov 24, 2015·3 cites·29 claims
- 3278US9177905B2Chip package having sensing element and method for forming the sameXINTEC INC·Filed 2013·Granted Nov 3, 2015·4 cites·20 claims
- 3377US11137559B2Optical chip package and method for forming the sameXINTEC INC·Filed 2020·Granted Oct 5, 2021·1 cites·29 claims
- 3477US9881889B2Chip package and method for fabricating the sameXINTEC INC·Filed 2014·Granted Jan 30, 2018·4 cites·18 claims
- 3575US10424540B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Sep 24, 2019·2 cites·13 claims
- 3675US9947716B2Chip package and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 17, 2018·2 cites·10 claims
- 3775US9640405B2Chip package having a laser stop structureXINTEC INC·Filed 2015·Granted May 2, 2017·2 cites·10 claims
- 3875US9406578B2Chip package having extended depression for electrical connection and method of manufacturing the sameXINTEC INC·Filed 2015·Granted Aug 2, 2016·2 cites·22 claims
- 3975US9209124B2Chip packageXINTEC INC·Filed 2013·Granted Dec 8, 2015·3 cites·26 claims
- 4075US9177919B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted Nov 3, 2015·3 cites·23 claims
- 4174US10152180B2Chip scale sensing chip package and a manufacturing method thereofXINTEC INC·Filed 2016·Granted Dec 11, 2018·2 cites·28 claims
- 4274US9997473B2Chip package and method for forming the sameXINTEC INC·Filed 2017·Granted Jun 12, 2018·2 cites·23 claims
- 4374US9711425B2Sensing module and method for forming the sameXINTEC INC·Filed 2016·Granted Jul 18, 2017·2 cites·22 claims
- 4474US9570633B2Semiconductor package and manufacturing method thereofXINTEC INC·Filed 2014·Granted Feb 14, 2017·2 cites·26 claims
- 4574US8975755B2Chip packageXINTEC INC·Filed 2014·Granted Mar 10, 2015·3 cites·20 claims
- 4673US9799778B2Chip package having a trench exposed protruding conductive padXINTEC INC·Filed 2016·Granted Oct 24, 2017·3 cites·21 claims
- 4773US9653422B2Chip package and method for forming the sameXINTEC INC·Filed 2015·Granted May 16, 2017·2 cites·19 claims
- 4873US9611143B2Method for forming chip packageXINTEC INC·Filed 2015·Granted Apr 4, 2017·2 cites·20 claims
- 4973US9349710B2Chip package and method for forming the sameXINTEC INC·Filed 2014·Granted May 24, 2016·2 cites·20 claims
- 5073US9287417B2Semiconductor chip package and method for manufacturing thereofXINTEC INC·Filed 2014·Granted Mar 15, 2016·3 cites·18 claims
Showing the top 50 of 253 patent records by PatentIndex Score.
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