Assignee
XUE YAN XUN
US·26 granted patents·1 pending application·158 citations·filing 2009–2014
Top patents by PatentIndex Score
27 records- 0194US8642385B2Wafer level package structure and the fabrication method thereofXUE YAN XUN·Filed 2011·Granted Feb 4, 2014·22 cites·29 claims
- 0292US8778735B1Packaging method of molded wafer level chip scale package (WLCSP)XUE YAN XUN·Filed 2013·Granted Jul 15, 2014·14 cites·10 claims
- 0391US8436429B2Stacked power semiconductor device using dual lead frame and manufacturing methodXUE YAN XUN·Filed 2011·Granted May 7, 2013·13 cites·10 claims
- 0490US8564110B2Power device with bottom source electrodeXUE YAN XUN·Filed 2012·Granted Oct 22, 2013·12 cites·16 claims
- 0589US8481368B2Semiconductor package of a flipped MOSFET and its manufacturing methodXUE YAN XUN·Filed 2011·Granted Jul 9, 2013·11 cites·5 claims
- 0686US8575006B2Process to form semiconductor packages with external leadsXUE YAN XUN·Filed 2009·Granted Nov 5, 2013·14 cites·20 claims
- 0786US8178954B2Structure of mixed semiconductor encapsulation structure with multiple chips and capacitorsXUE YAN XUN·Filed 2010·Granted May 15, 2012·7 cites·12 claims
- 0885US8563361B2Packaging method of molded wafer level chip scale package (WLCSP)XUE YAN XUN·Filed 2012·Granted Oct 22, 2013·8 cites·8 claims
- 0981US8586414B2Top exposed package and assembly methodXUE YAN XUN·Filed 2010·Granted Nov 19, 2013·6 cites·17 claims
- 1081US8519525B2Semiconductor encapsulation and method thereofXUE YAN XUN·Filed 2010·Granted Aug 27, 2013·5 cites·9 claims
- 1180US8716069B2Semiconductor device employing aluminum alloy lead-frame with anodized aluminumXUE YAN XUN·Filed 2012·Granted May 6, 2014·5 cites·9 claims
- 1279US8981539B2Packaged power semiconductor with interconnection of dies and metal clips on lead frameXUE YAN XUN·Filed 2013·Granted Mar 17, 2015·4 cites·14 claims
- 1378US9224669B2Method and structure for wafer level packaging with large contact areaXUE YAN XUN·Filed 2013·Granted Dec 29, 2015·3 cites·8 claims
- 1478US8283212B2Method of making a copper wire bond packageXUE YAN XUN·Filed 2010·Granted Oct 9, 2012·5 cites·12 claims
- 1578US8247288B2Method of integrating a MOSFET with a capacitorXUE YAN XUN·Filed 2010·Granted Aug 21, 2012·5 cites·23 claims
- 1678US8076183B2Method of attaching an interconnection plate to a semiconductor die within a leadframe packageXUE YAN XUN·Filed 2009·Granted Dec 13, 2011·7 cites·21 claims
- 1775US8482048B2Metal oxide semiconductor field effect transistor integrating a capacitorXUE YAN XUN·Filed 2010·Granted Jul 9, 2013·4 cites·20 claims
- 1874US8853003B2Wafer level chip scale package with thick bottom metal exposed and preparation method thereofXUE YAN XUN·Filed 2012·Granted Oct 7, 2014·3 cites·13 claims
- 1972US8933518B2Stacked power semiconductor device using dual lead frameXUE YAN XUN·Filed 2013·Granted Jan 13, 2015·3 cites·7 claims
- 2071US8710648B2Wafer level packaging structure with large contact area and preparation method thereofXUE YAN XUN·Filed 2012·Granted Apr 29, 2014·3 cites·9 claims
- 2170US8785296B2Packaging method with backside wafer dicingXUE YAN XUN·Filed 2012·Granted Jul 22, 2014·2 cites·20 claims
- 2267US9391005B2Method for packaging a power device with bottom source electrodeXUE YAN XUN·Filed 2013·Granted Jul 12, 2016·2 cites·5 claims
- 2354US9214419B2Power semiconductor device and preparation method thereofXUE YAN XUN·Filed 2014·Granted Dec 15, 2015·0 cites·15 claims
- 2452US8933550B2Structure of mixed semiconductor encapsulation structure with multiple chips and capacitorsXUE YAN XUN·Filed 2012·Granted Jan 13, 2015·0 cites·8 claims
- 2550US8431993B2Semiconductor package for forming a leadframe packageXUE YAN XUN·Filed 2011·Granted Apr 30, 2013·0 cites·3 claims
- 2644US9929076B2Semiconductor package of a flipped MOSFET chip and a multi-based die paddle with top surface groove-divided multiple connecting areas for connection to the flipped MOSFET electrodesXUE YAN XUN·Filed 2013·Granted Mar 27, 2018·0 cites·3 claims
- 2744US2016056098A9Semiconductor device employing aluminum alloy lead-frame with anodized aluminumXUE YAN XUN·Filed 2014·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →