Assignee

YABE MASAAKI

JP·1 granted patent·53 citations·filing 2009–2009

Technology mixH01F1 H02J1 H04B1

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0190US8643219B2Electronic equipment and method for connecting electronic circuit substrateYABE MASAAKI·Filed 2009·Granted Feb 4, 2014·53 cites·15 claims

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