Assignee
YAMAHA ROBOTICS CO LTD
JP·20 granted patents·0 citations·filing 2020–2023
Top patents by PatentIndex Score
20 records- 0162US12485586B2Mold clamping deviceYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Dec 2, 2025·0 cites·4 claims
- 0261US12589529B2Resin sealing apparatusYAMAHA ROBOTICS CO LTD·Filed 2023·Granted Mar 31, 2026·0 cites·8 claims
- 0355US12487206B2Defect detection device and defect detection methodYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Dec 2, 2025·0 cites·20 claims
- 0454US12551926B2Ultrasonic hornYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Feb 17, 2026·0 cites·7 claims
- 0554US12479135B2Resin-sealing methodYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Nov 25, 2025·0 cites·6 claims
- 0653US12487076B2Measurement device, measurement method, and bonding systemYAMAHA ROBOTICS CO LTD·Filed 2020·Granted Dec 2, 2025·0 cites·11 claims
- 0753US12469727B2Defect detection device and defect detection methodYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Nov 11, 2025·0 cites·17 claims
- 0852US12480762B2Mounting device, and method for detecting degree of parallelism of mounting deviceYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Nov 25, 2025·0 cites·7 claims
- 0951US12557600B2Semiconductor device manufacturing device and manufacturing methodYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Feb 17, 2026·0 cites·7 claims
- 1049US12568792B2Semiconductor device manufacturing device and manufacturing methodYAMAHA ROBOTICS CO LTD·Filed 2020·Granted Mar 3, 2026·0 cites·17 claims
- 1149US12475551B2Manufacturing apparatus of semiconductor device and manufacturing method of semiconductor deviceYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Nov 18, 2025·0 cites·6 claims
- 1248US12575368B2Apparatus for producing semiconductor device, and method for producing semiconductor deviceYAMAHA ROBOTICS CO LTD·Filed 2020·Granted Mar 10, 2026·0 cites·8 claims
- 1348US12563999B2Manufacturing apparatus and manufacturing method of semiconductor deviceYAMAHA ROBOTICS CO LTD·Filed 2020·Granted Feb 24, 2026·0 cites·2 claims
- 1448US12519003B2Transfer apparatus capable of suppressing side slip of workpiece lifted by non-contact chuckYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Jan 6, 2026·0 cites·3 claims
- 1546US12494386B2Electronic component cleaning apparatusYAMAHA ROBOTICS CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·8 claims
- 1645US12485460B2Acoustic foreign matter removal deviceYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Dec 2, 2025·0 cites·9 claims
- 1743US12557682B2Mounting device comprising semiconductor chip mounted through thermo-compression tool and mounting method thereofYAMAHA ROBOTICS CO LTD·Filed 2020·Granted Feb 17, 2026·0 cites·5 claims
- 1842US12489004B2Surface treatment apparatus and manufacturing apparatus for semiconductor deviceYAMAHA ROBOTICS CO LTD·Filed 2020·Granted Dec 2, 2025·0 cites·4 claims
- 1938US12476219B2Wire bonding state determination method and device using a prescribed electric waveformYAMAHA ROBOTICS CO LTD·Filed 2020·Granted Nov 18, 2025·0 cites·6 claims
- 2031US12489003B2Wire bonding system, inspection device, wire bonding method, and recording mediumYAMAHA ROBOTICS CO LTD·Filed 2021·Granted Dec 2, 2025·0 cites·8 claims
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