Assignee
YAMANISHI KEISUKE
JP·2 granted patents·3 pending applications·0 citations·filing 2009–2011
Top patents by PatentIndex Score
5 records- 0158US8668994B2Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using sameYAMANISHI KEISUKE·Filed 2009·Granted Mar 11, 2014·0 cites·19 claims
- 0243US2011300401A1Rolled Copper Foil or Electrolytic Copper Foil for Electronic Circuit, and Method of Forming Electronic Circuit using sameYAMANISHI KEISUKE·Filed 2010·Application pending·0 cites
- 0340US8580390B2Rolled copper foil or electrolytic copper foil for electronic circuit, and method of forming electronic circuit using sameYAMANISHI KEISUKE·Filed 2009·Granted Nov 12, 2013·0 cites·19 claims
- 0439US2012318568A1Electronic circuit, method for forming same, and copper clad laminate for forming electronic circuitYAMANISHI KEISUKE·Filed 2011·Application pending·0 cites
- 0533US2013071652A1Laminate for flexible wiringYAMANISHI KEISUKE·Filed 2011·Application pending·0 cites
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