Assignee
YAMAZAKI TAKAO
JP·7 granted patents·4 pending applications·41 citations·filing 2007–2013
Top patents by PatentIndex Score
11 records- 0185US8525323B2Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating packageYAMAZAKI TAKAO·Filed 2009·Granted Sep 3, 2013·12 cites·21 claims
- 0285US8411450B2Electronic device package, module, and electronic deviceYAMAZAKI TAKAO·Filed 2007·Granted Apr 2, 2013·14 cites·26 claims
- 0381US8338940B2Semiconductor deviceYAMAZAKI TAKAO·Filed 2009·Granted Dec 25, 2012·12 cites·26 claims
- 0473US8785853B2Infrared sensor package and electronic device equipped therewithYAMAZAKI TAKAO·Filed 2011·Granted Jul 22, 2014·3 cites·6 claims
- 0551US8236616B2Semiconductor device and manufacturing method thereofYAMAZAKI TAKAO·Filed 2011·Granted Aug 7, 2012·0 cites·11 claims
- 0651US8093709B2Semiconductor device and manufacturing method thereofYAMAZAKI TAKAO·Filed 2011·Granted Jan 10, 2012·0 cites·12 claims
- 0750US2014022718A1Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed packageYAMAZAKI TAKAO·Filed 2013·Application pending·0 cites
- 0849US2013291380A1Encapsulating package, printed circuit board, electronic device and method for manufacturing encapsulating packageYAMAZAKI TAKAO·Filed 2013·Application pending·0 cites
- 0946US8120921B2Device having electronic components mounted therein and method for manufacturing such deviceYAMAZAKI TAKAO·Filed 2008·Granted Feb 21, 2012·0 cites·15 claims
- 1044US2012106085A1Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed packageYAMAZAKI TAKAO·Filed 2010·Application pending·0 cites
- 1136US2012181683A1Three-dimensionally integrated semiconductor device and electronic device incorporation by referenceYAMAZAKI TAKAO·Filed 2012·Application pending·0 cites
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