Assignee
YANG CHIH-KUANG
TW·9 granted patents·1 pending application·10 citations·filing 2007–2012
Top patents by PatentIndex Score
10 records- 0173US8288246B2Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structureYANG CHIH-KUANG·Filed 2011·Granted Oct 16, 2012·2 cites·12 claims
- 0271US8405223B2Multi-layer via structureYANG CHIH-KUANG·Filed 2011·Granted Mar 26, 2013·3 cites·16 claims
- 0361US9107315B2Via structure in multi-layer substrateYANG CHIH-KUANG·Filed 2009·Granted Aug 11, 2015·1 cites·9 claims
- 0461US8278562B2Multi-layer substrate and manufacturing method thereofYANG CHIH-KUANG·Filed 2007·Granted Oct 2, 2012·1 cites·8 claims
- 0558US8294039B2Surface finish structure of multi-layer substrate and manufacturing method thereofYANG CHIH-KUANG·Filed 2007·Granted Oct 23, 2012·3 cites·22 claims
- 0656US9398704B2Manufacturing method of metal structure of flexible multi-layer substrateYANG CHIH-KUANG·Filed 2012·Granted Jul 19, 2016·0 cites·10 claims
- 0750US8111519B2Hybrid structure of multi-layer substrates and manufacture method thereofYANG CHIH-KUANG·Filed 2011·Granted Feb 7, 2012·0 cites·11 claims
- 0849US8266797B2Method of manufacturing a multi-layer substrateYANG CHIH-KUANG·Filed 2011·Granted Sep 18, 2012·0 cites·9 claims
- 0948US2012107745A1Via structure in multi-layer substrate and manufacturing method thereofYANG CHIH-KUANG·Filed 2012·Application pending·0 cites
- 1043US8815333B2Manufacturing method of metal structure in multi-layer substrateYANG CHIH-KUANG·Filed 2012·Granted Aug 26, 2014·0 cites·21 claims
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