Assignee
YANG DAEWOOK
KR·3 granted patents·10 citations·filing 2008–2012
Top patents by PatentIndex Score
3 records- 0184US8409918B2Semiconductor device and method of forming pre-molded substrate to reduce warpage during die mountingYANG DAEWOOK·Filed 2010·Granted Apr 2, 2013·9 cites·22 claims
- 0259US8709877B2Integrated circuit packaging system with an encapsulation and method of manufacture thereofYANG DAEWOOK·Filed 2012·Granted Apr 29, 2014·1 cites·20 claims
- 0345US8841782B2Integrated circuit package system with mold gateYANG DAEWOOK·Filed 2008·Granted Sep 23, 2014·0 cites·20 claims
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