Assignee
Yang ming-kun
TW·1 granted patent·3 pending applications·0 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0135US8692300B2Interposer and method for forming the sameYang ming-kun·Filed 2012·Granted Apr 8, 2014·0 cites·20 claims
- 0230US2011291153A1Chip submount, chip package, and fabrication method thereofYang ming-kun·Filed 2011·Application pending·0 cites
- 0330US2012080706A1Chip package and method for forming the sameYang ming-kun·Filed 2011·Application pending·0 cites
- 0430US2012104445A1Chip package and method for forming the sameYang ming-kun·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →