Assignee
YANG MING-TZONG
TW·4 granted patents·3 pending applications·4 citations·filing 2006–2011
Top patents by PatentIndex Score
7 records- 0175US8278733B2Bonding pad structure and integrated circuit chip using such bonding pad structureYANG MING-TZONG·Filed 2010·Granted Oct 2, 2012·4 cites·20 claims
- 0249US8921941B2ESD protection device and method for fabricating the sameYANG MING-TZONG·Filed 2011·Granted Dec 30, 2014·0 cites·3 claims
- 0346US8779591B2Bump pad structureYANG MING-TZONG·Filed 2011·Granted Jul 15, 2014·0 cites·19 claims
- 0442US2009057907A1Interconnection structureYANG MING-TZONG·Filed 2007·Application pending·0 cites
- 0541US2009002114A1Integrated inductorYANG MING-TZONG·Filed 2007·Application pending·0 cites
- 0639US9373727B2Semiconductor diodeYANG MING-TZONG·Filed 2011·Granted Jun 21, 2016·0 cites·16 claims
- 0735US2007166910A1Memory structure, memory device and manufacturing method thereofYANG MING-TZONG·Filed 2006·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →