Assignee
YANG SEUNG TAEK
KR·4 granted patents·23 citations·filing 2009–2011
Top patents by PatentIndex Score
4 records- 0186US8178975B2Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layersYANG SEUNG TAEK·Filed 2010·Granted May 15, 2012·9 cites·9 claims
- 0280US8159066B2Semiconductor package having a heat dissipation memberYANG SEUNG TAEK·Filed 2009·Granted Apr 17, 2012·9 cites·17 claims
- 0379US8154098B2Reverse image sensor module and method for manufacturing the sameYANG SEUNG TAEK·Filed 2009·Granted Apr 10, 2012·4 cites·11 claims
- 0460US8502366B2Semiconductor packageYANG SEUNG TAEK·Filed 2011·Granted Aug 6, 2013·1 cites·11 claims
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