Assignee
YANGTZE MEMORY TECH CO LTD
CN·1,280 granted patents·878 pending applications·1,602 citations·filing 2018–2025
Top patents by PatentIndex Score
2,158 records- 0199US11170836B1Method for reading and writing memory cells in three-dimensional FeRAMYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Nov 9, 2021·16 cites·20 claims
- 0299US11158622B1Three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Oct 26, 2021·18 cites·20 claims
- 0398US11785776B2Through array contact structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Oct 10, 2023·6 cites·20 claims
- 0498US11721377B2Method for reading and writing memory cells in three-dimensional FeRAMYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 8, 2023·6 cites·19 claims
- 0598US11699659B2Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 11, 2023·3 cites·20 claims
- 0698US11562985B2Bonded semiconductor devices having processor and dynamic random-access memory and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jan 24, 2023·12 cites·20 claims
- 0798US11562945B2Semiconductor device having a spacer structure in a conductive layer and a contact structure in the spacer structureYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 24, 2023·7 cites·20 claims
- 0898US11551753B2Three-dimensional memory device with embedded dynamic random-access memoryYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jan 10, 2023·7 cites·20 claims
- 0998US11232839B1Erasing method for 3D NAND flash memoryYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 25, 2022·12 cites·20 claims
- 1098US11227871B2Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 18, 2022·4 cites·20 claims
- 1198US11189326B1Non-destructive mode cache programming in NAND flash memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Nov 30, 2021·13 cites·20 claims
- 1298US11133038B1Multi-die peak power management for three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 28, 2021·5 cites·20 claims
- 1398US11133325B2Memory cell structure of a three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 28, 2021·14 cites·9 claims
- 1498US10985142B2Multi-deck three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Apr 20, 2021·6 cites·21 claims
- 1598US10636813B1Three-dimensional memory devices having transferred interconnect layer and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Apr 28, 2020·37 cites·25 claims
- 1698US10600763B1Multi-deck three-dimensional memory devices and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Mar 24, 2020·34 cites·19 claims
- 1798US10600781B1Multi-stack three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Mar 24, 2020·37 cites·20 claims
- 1898US10553604B2Through array contact structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Feb 4, 2020·31 cites·20 claims
- 1998US10510415B1Memory device using comb-like routing structure for reduced metal line loadingYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Dec 17, 2019·36 cites·20 claims
- 2098US10283452B2Three-dimensional memory devices having a plurality of NAND stringsYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted May 7, 2019·61 cites·13 claims
- 2198US10147732B1Source structure of three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Dec 4, 2018·66 cites·21 claims
- 2297US11963356B2Three-dimensional memory device without gate line slits and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Apr 16, 2024·2 cites·20 claims
- 2397US11862565B2Contact structures for three-dimensional memoryYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 2, 2024·4 cites·5 claims
- 2497US11758732B2Hybrid bonding contact structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Sep 12, 2023·3 cites·20 claims
- 2597US11574922B2Three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 7, 2023·3 cites·20 claims
- 2697US11527547B2Hybrid bonding contact structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Dec 13, 2022·3 cites·20 claims
- 2797US11462560B2Methods for forming three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Oct 4, 2022·4 cites·20 claims
- 2897US11380629B2Methods for forming three-dimensional memory devices with supporting structure for staircase regionYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jul 5, 2022·5 cites·20 claims
- 2997US11233007B2Staircase structure in three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 25, 2022·4 cites·20 claims
- 3097US11133293B2Three-dimensional memory device with three-dimensional phase-change memoryYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Sep 28, 2021·3 cites·17 claims
- 3197US10930661B2Embedded pad structures of three-dimensional memory devices and fabrication methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Feb 23, 2021·16 cites·8 claims
- 3297US10923491B2Hybrid bonding contact structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Feb 16, 2021·4 cites·20 claims
- 3397US10886256B2Methods and systems for wafer bonding alignment compensationYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 5, 2021·4 cites·21 claims
- 3497US10593690B2Hybrid bonding contact structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Mar 17, 2020·21 cites·20 claims
- 3596US12255181B2Methods for forming three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Mar 18, 2025·2 cites·20 claims
- 3696US12136586B2Semiconductor devices having a conductive layer stacking with an insulating layer and a spacer structure through the conductive layerYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 5, 2024·2 cites·19 claims
- 3796US12136618B2Three-dimensional memory device with backside source contactYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Nov 5, 2024·2 cites·20 claims
- 3896US12075621B2Three-dimensional memory device and method for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 27, 2024·2 cites·16 claims
- 3996US11935596B2Three-dimensional memory devices having polysilicon layer and bonded semiconductor structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Mar 19, 2024·4 cites·20 claims
- 4096US11862250B2Open block-based read offset compensation in read operation of memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jan 2, 2024·7 cites·20 claims
- 4196US11749641B2Unified semiconductor devices having processor and heterogeneous memories and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Sep 5, 2023·3 cites·20 claims
- 4296US11557601B2Three-dimensional memory devicesYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 17, 2023·5 cites·20 claims
- 4396US11501822B2Non-volatile memory device and control methodYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Nov 15, 2022·5 cites·20 claims
- 4496US11361988B2Staircase formation in three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jun 14, 2022·3 cites·20 claims
- 4596US11222903B2Word line structure of three-dimensional memory deviceYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Jan 11, 2022·4 cites·20 claims
- 4696US11031377B2Integration of three-dimensional NAND memory devices with multiple functional chipsYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jun 8, 2021·14 cites·20 claims
- 4796US10978153B13D NAND flash and operation method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Apr 13, 2021·9 cites·18 claims
- 4896US10811071B1Three-dimensional memory device with static random-access memoryYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Oct 20, 2020·17 cites·20 claims
- 4996US10566336B1Three-dimensional memory devices having through array contacts and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Feb 18, 2020·11 cites·17 claims
- 5096US10559592B1Memory device and forming method thereofYANGTZE MEMORY TECH CO LTD·Filed 2018·Granted Feb 11, 2020·14 cites·20 claims
Showing the top 50 of 2,158 patent records by PatentIndex Score.
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