Assignee
YAP JIA LIN
MY·1 granted patent·4 pending applications·2 citations·filing 2013–2013
Top patents by PatentIndex Score
5 records- 0156US8933547B1Lead frame with power bar for semiconductor deviceYAP JIA LIN·Filed 2013·Granted Jan 13, 2015·2 cites·19 claims
- 0230US2014263584A1Wire bonding apparatus and methodYAP JIA LIN·Filed 2013·Application pending·0 cites
- 0329US2015075849A1Semiconductor device and lead frame with interposerYAP JIA LIN·Filed 2013·Application pending·0 cites
- 0429US2014374467A1Capillary bonding tool and method of forming wire bondsYAP JIA LIN·Filed 2013·Application pending·0 cites
- 0528US2014374151A1Wire bonding method for flexible substratesYAP JIA LIN·Filed 2013·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →