Individual holder
YAP WENG F
US·11 granted patents·87 citations·filing 2013–2014
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
11 records- 0197US9299670B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofYAP WENG F·Filed 2013·Granted Mar 29, 2016·39 cites·20 claims
- 0290US9129981B2Methods for the production of microelectronic packages having radiofrequency stand-off layersYAP WENG F·Filed 2013·Granted Sep 8, 2015·11 cites·20 claims
- 0389US9281284B2System-in-packages having vertically-interconnected leaded components and methods for the fabrication thereofYAP WENG F·Filed 2014·Granted Mar 8, 2016·11 cites·19 claims
- 0484US9281286B1Microelectronic packages having texturized solder pads and methods for the fabrication thereofYAP WENG F·Filed 2014·Granted Mar 8, 2016·7 cites·20 claims
- 0582US9257419B2Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereofYAP WENG F·Filed 2014·Granted Feb 9, 2016·5 cites·20 claims
- 0682US9024429B2Microelectronic packages containing opposing devices and methods for the fabrication thereofYAP WENG F·Filed 2013·Granted May 5, 2015·6 cites·20 claims
- 0773US9401339B2Wafer level packages having non-wettable solder collars and methods for the fabrication thereofYAP WENG F·Filed 2014·Granted Jul 26, 2016·3 cites·20 claims
- 0867US9997492B2Optically-masked microelectronic packages and methods for the fabrication thereofYAP WENG F·Filed 2013·Granted Jun 12, 2018·2 cites·20 claims
- 0967US8963318B2Packaged semiconductor deviceYAP WENG F·Filed 2013·Granted Feb 24, 2015·2 cites·17 claims
- 1062US9524950B2Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereofYAP WENG F·Filed 2013·Granted Dec 20, 2016·1 cites·18 claims
- 1139US8741666B1Methods relating to intermetallic testing of bond integrity between bond pads and copper-containing bond wiresYAP WENG F·Filed 2013·Granted Jun 3, 2014·0 cites·20 claims
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