Assignee
YASUDA YUSUKE
JP·2 granted patents·2 pending applications·8 citations·filing 2007–2012
Top patents by PatentIndex Score
4 records- 0173US8821676B2Low temperature bonding material comprising coated metal nanoparticles, and bonding methodYASUDA YUSUKE·Filed 2011·Granted Sep 2, 2014·3 cites·7 claims
- 0270US8821768B2Bonding method and bonding material using metal particleYASUDA YUSUKE·Filed 2007·Granted Sep 2, 2014·5 cites·14 claims
- 0347US2012104618A1Low temperature bonding material and bonding methodYASUDA YUSUKE·Filed 2012·Application pending·0 cites
- 0441US2007298244A1Bonding materials having particle with anisotropic shapeYASUDA YUSUKE·Filed 2007·Application pending·0 cites
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