Assignee
YAZAKI METER CO LTD
JP·3 granted patents·18 citations·filing 1993–1994
Top patents by PatentIndex Score
3 records- 0141US5545594ASemiconductor sensor anodic-bonding process, wherein bonding of corrugation is preventedYAZAKI METER CO LTD·Filed 1993·Granted Aug 13, 1996·8 cites·2 claims
- 0236US5484745AMethod for forming a semiconductor sensorYAZAKI METER CO LTD·Filed 1993·Granted Jan 16, 1996·5 cites·7 claims
- 0335US5528070ASemiconductor sensor manufactured through anodic-bonding processYAZAKI METER CO LTD·Filed 1994·Granted Jun 18, 1996·5 cites·5 claims
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