Assignee
YIBU SEMICONDUCTOR CO LTD
CN·16 granted patents·21 pending applications·6 citations·filing 2021–2025
Top patents by PatentIndex Score
37 records- 0195US12125776B2Method for forming semiconductor package and semiconductor packageYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Oct 22, 2024·2 cites·14 claims
- 0295US2025391816A1Method of Forming Stacked Chip Packages Using Chip CouplersYIBU SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 0394US12218090B2Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assemblyYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Feb 4, 2025·2 cites·18 claims
- 0488US12159850B2Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assemblyYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Dec 3, 2024·1 cites·20 claims
- 0587US12154884B2Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assemblyYIBU SEMICONDUCTOR CO LTD·Filed 2022·Granted Nov 26, 2024·1 cites·20 claims
- 0686US12362327B2Method of forming packages of stacked chipsYIBU SEMICONDUCTOR CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 0777US2025118649A1Method for Forming Semiconductor Package and Semiconductor PackageYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 0876US12406964B2Chip package and method of forming chip packagesYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Sep 2, 2025·0 cites·21 claims
- 0976US12087737B2Method of forming chip package having stacked chipsYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·20 claims
- 1076US11973061B2Chip package including stacked chips and chip couplersYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Apr 30, 2024·0 cites·20 claims
- 1172US12293986B2Method for forming chip packages and a chip packageYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted May 6, 2025·0 cites·17 claims
- 1272US12224267B2Chip interconnecting method, interconnect device and method for forming chip packagesYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Feb 11, 2025·0 cites·19 claims
- 1371US12087734B2Method for forming chip packages and a chip package having a chipset comprising a first chip and a second chipYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Sep 10, 2024·0 cites·17 claims
- 1471US2024222323A1Fan-out stacked package, method of making and electronic device including the stacked packageYIBU SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1571US2024222329A1Stacked package, method of making and electronic device including the stacked packageYIBU SEMICONDUCTOR CO LTD·Filed 2023·Application pending·0 cites
- 1665US12046525B2Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assemblyYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Jul 23, 2024·0 cites·20 claims
- 1765US2022293504A1Semiconductor packaging structure, method, device and electronic productYIBU SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1865US2022293547A1Semiconductor packaging structure, method, device and electronic productYIBU SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 1964US11955396B2Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assemblyYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Apr 9, 2024·0 cites·20 claims
- 2064US2025219043A1Semiconductor packaging method, semiconductor assembly component and electronic deviceYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 2164US2025219018A1Semiconductor packaging method, semiconductor assembly component and electronic deviceYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 2263US2025079427A1Method for fabricating fan-out packageYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 2363US2025132286A1Semiconductor packaging method, semiconductor assembly component and electronic deviceYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 2463US2025132287A1Semiconductor packaging method, semiconductor assembly component and electronic deviceYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 2562US2025054821A1Composite carrier, method of making and method of using the composite carrier in semiconductor packagingYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 2662US2024363489A1Chip stack and fabrication methodYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 2761US2024387500A1Multi-chip package and method of makingYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 2860US2024266320A1Method of interconnecting semiconductor devices and assembly of interconnected semiconductor devicesYIBU SEMICONDUCTOR CO LTD·Filed 2024·Application pending·0 cites
- 2959US2026005111A1Semiconductor packaging method, semiconductor package and electronic deviceYIBU SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 3056US12431465B2Chip package and method of forming chip packagesYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Sep 30, 2025·0 cites·20 claims
- 3154US2025329702A1Semiconductor packaging method, semiconductor assembly component and electronic deviceYIBU SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 3254US2025329700A1Semiconductor packaging method, semiconductor assembly component and electronic deviceYIBU SEMICONDUCTOR CO LTD·Filed 2025·Application pending·0 cites
- 3353US12500203B2Semiconductor packaging method, semiconductor assembly and electronic device comprising semiconductor assemblyYIBU SEMICONDUCTOR CO LTD·Filed 2022·Granted Dec 16, 2025·0 cites·11 claims
- 3453US12368124B2Method for forming semiconductor package and semiconductor packageYIBU SEMICONDUCTOR CO LTD·Filed 2021·Granted Jul 22, 2025·0 cites·14 claims
- 3553US2022320028A1Semiconductor packaging structure, method, device and electronic productYIBU SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 3652US2022230986A1Semiconductor Assembly Packaging Method, Semiconductor Assembly and Electronic DeviceYIBU SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
- 3752US2022216176A1Semiconductor Assembly Packaging Method, Semiconductor Assembly and Electronic DeviceYIBU SEMICONDUCTOR CO LTD·Filed 2022·Application pending·0 cites
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