Assignee
YIU HO-YIN
TW·3 granted patents·7 citations·filing 2012–2012
Top patents by PatentIndex Score
3 records- 0174US8791768B2Capacitive coupler packaging structureYIU HO-YIN·Filed 2012·Granted Jul 29, 2014·4 cites·20 claims
- 0271US9088206B2Power module and the method of packaging the sameYIU HO-YIN·Filed 2012·Granted Jul 21, 2015·3 cites·20 claims
- 0363US8981497B2Chip package structure and method for forming the sameYIU HO-YIN·Filed 2012·Granted Mar 17, 2015·0 cites·18 claims
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