Assignee
YMT CO LTD
KR·8 granted patents·7 pending applications·6 citations·filing 2006–2023
Top patents by PatentIndex Score
15 records- 0187US9758889B2Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured therebyYMT CO LTD·Filed 2014·Granted Sep 12, 2017·5 cites·7 claims
- 0273US12495494B2Metal foil, carrier with metal foil comprising the same and printed circuit board including the sameYMT CO LTD·Filed 2021·Granted Dec 9, 2025·1 cites·7 claims
- 0370US12534426B2Leveler and electroplating composition for filling via holeYMT CO LTD·Filed 2023·Granted Jan 27, 2026·0 cites·5 claims
- 0458US2024174812A1Leveling agent and electroplating composition for forming circuit pattern including the sameYMT CO LTD·Filed 2022·Application pending·0 cites
- 0557US2025031316A1Methods for forming circuit pattern on substrate using metal foil with low surface roughnessYMT CO LTD·Filed 2023·Application pending·0 cites
- 0655US12408279B2Release layer for metal foil with carrier and metal foil comprising the sameYMT CO LTD·Filed 2021·Granted Sep 2, 2025·0 cites·8 claims
- 0750US11499233B2Plated laminate and printed circuit boardYMT CO LTD·Filed 2019·Granted Nov 15, 2022·0 cites·6 claims
- 0849US12139811B2Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the sameYMT CO LTD·Filed 2020·Granted Nov 12, 2024·0 cites·3 claims
- 0949US11028495B2Method for producing porous copper foil and porous copper foil produced by the sameYMT CO LTD·Filed 2018·Granted Jun 8, 2021·0 cites·3 claims
- 1048US2014098504A1Electroplating method for printed circuit boardYMT CO LTD·Filed 2012·Application pending·0 cites
- 1148US2024133039A1Leveling agent and electrolytic composition for filling via holeYMT CO LTD·Filed 2022·Application pending·0 cites
- 1245US12522559B2Leveling agent and electrolytic composition for filling via holeYMT CO LTD·Filed 2022·Granted Jan 13, 2026·0 cites·8 claims
- 1344US2023203693A1Surface modifier for electrolytic nickel plating and nickel electroplating solution including the sameYMT CO LTD·Filed 2021·Application pending·0 cites
- 1441US2024260200A1Metal foil with carrier foil, laminate for printed wiring board using same, and manufacturing method for laminateYMT CO LTD·Filed 2022·Application pending·0 cites
- 1540US2007104929A1Method for plating printed circuit board and printed circuit board manufactured therefromYMT CO LTD·Filed 2006·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →