Assignee
YOON IN SANG
KR·9 granted patents·103 citations·filing 2006–2014
Top patents by PatentIndex Score
9 records- 0196US8299595B2Integrated circuit package system with package stacking and method of manufacture thereofYOON IN SANG·Filed 2010·Granted Oct 30, 2012·38 cites·18 claims
- 0294US8409917B2Integrated circuit packaging system with an interposer substrate and method of manufacture thereofYOON IN SANG·Filed 2011·Granted Apr 2, 2013·19 cites·20 claims
- 0389US8765525B2Method of manufacturing an integrated circuit packaging system including lasering through encapsulant over interposerYOON IN SANG·Filed 2011·Granted Jul 1, 2014·8 cites·9 claims
- 0482US9385066B1Integrated circuit packaging system with molded laser via interposer and method of manufacture thereofYOON IN SANG·Filed 2014·Granted Jul 5, 2016·4 cites·10 claims
- 0581US8497575B2Semiconductor packaging system with an aligned interconnect and method of manufacture thereofYOON IN SANG·Filed 2010·Granted Jul 30, 2013·6 cites·20 claims
- 0681US8124459B2Bump chip carrier semiconductor package systemYOON IN SANG·Filed 2006·Granted Feb 28, 2012·11 cites·20 claims
- 0778US9905491B1Interposer substrate designs for semiconductor packagesYOON IN SANG·Filed 2013·Granted Feb 27, 2018·5 cites·6 claims
- 0877US8130512B2Integrated circuit package system and method of package stackingYOON IN SANG·Filed 2008·Granted Mar 6, 2012·6 cites·20 claims
- 0974US8247894B2Integrated circuit package system with step mold recessYOON IN SANG·Filed 2008·Granted Aug 21, 2012·6 cites·20 claims
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