Assignee
YOON SANG-WON
8 granted patents·127 citations·filing 2007–2012
Top patents by PatentIndex Score
8 records- 0196US8154119B2Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturingYOON SANG WON·Filed 2010·Granted Apr 10, 2012·56 cites·20 claims
- 0285USD649542SNet bookYOON SANG-WON·Filed 2010·Granted Nov 29, 2011·33 cites·1 claims
- 0382US10058951B2Alloy formation control of transient liquid phase bondingYOON SANG WON·Filed 2012·Granted Aug 28, 2018·7 cites·13 claims
- 0477US8138019B2Integrated (multilayer) circuits and process of producing the sameYOON SANG WON·Filed 2009·Granted Mar 20, 2012·7 cites·26 claims
- 0577US7513582B2Slide rail stopper having anti-opening and self-closing functionsYOON SANG-WON·Filed 2007·Granted Apr 7, 2009·16 cites·3 claims
- 0675US8803001B2Bonding area design for transient liquid phase bonding processYOON SANG WON·Filed 2011·Granted Aug 12, 2014·4 cites·17 claims
- 0773US8814030B2Improvements of long term bondline reliability of power electronics operating at high temperaturesYOON SANG WON·Filed 2012·Granted Aug 26, 2014·3 cites·20 claims
- 0862US8564117B2Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturingYOON SANG WON·Filed 2012·Granted Oct 22, 2013·1 cites·20 claims
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