Assignee
YOON TAE-SUNG
KR·1 granted patent·1 pending application·3 citations·filing 2008–2010
Top patents by PatentIndex Score
2 records- 0166US8294250B2Wiring substrate for a semiconductor chip, and semiconducotor package having the wiring substrateYOON TAE-SUNG·Filed 2010·Granted Oct 23, 2012·3 cites·11 claims
- 0253US2008187613A1Method of manufacturing wafer-level chip-size package and molding apparatus used in the methodYOON TAE-SUNG·Filed 2008·Application pending·0 cites
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