Assignee
YOSHIDA AKITO
US·6 granted patents·220 citations·filing 2009–2012
Top patents by PatentIndex Score
6 records- 0198US8222538B1Stackable via package and methodYOSHIDA AKITO·Filed 2009·Granted Jul 17, 2012·91 cites·20 claims
- 0297US8471154B1Stackable variable height via package and methodYOSHIDA AKITO·Filed 2009·Granted Jun 25, 2013·71 cites·18 claims
- 0395US8704368B1Stackable via package and methodYOSHIDA AKITO·Filed 2012·Granted Apr 22, 2014·15 cites·16 claims
- 0495US8623753B1Stackable protruding via package and methodYOSHIDA AKITO·Filed 2009·Granted Jan 7, 2014·41 cites·21 claims
- 0574US8227905B1Stackable semiconductor packageYOSHIDA AKITO·Filed 2011·Granted Jul 24, 2012·2 cites·19 claims
- 0654US8466545B1Stackable semiconductor packageYOSHIDA AKITO·Filed 2012·Granted Jun 18, 2013·0 cites·20 claims
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