Assignee
YOSHIKAWA SHUNSAKU
JP·1 granted patent·2 pending applications·0 citations·filing 2010–2018
Top patents by PatentIndex Score
3 records- 0159US2019118310A1Lead-Free Solder Alloy for Terminal Preliminary Plating, and Electronic ComponentYOSHIKAWA SHUNSAKU·Filed 2018·Application pending·0 cites
- 0245US9773721B2Lead-free solder alloy, connecting member and a method for its manufacture, and electronic partYOSHIKAWA SHUNSAKU·Filed 2014·Granted Sep 26, 2017·0 cites·15 claims
- 0336US2012199393A1Lead-free solder alloy, connecting member and a method for its manufacture, and electronic partYOSHIKAWA SHUNSAKU·Filed 2010·Application pending·0 cites
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