Assignee
YOSHIMURA HIDEAKI
JP·7 granted patents·5 pending applications·35 citations·filing 2008–2012
Top patents by PatentIndex Score
12 records- 0189US8110749B2Printed wiring boardYOSHIMURA HIDEAKI·Filed 2009·Granted Feb 7, 2012·20 cites·4 claims
- 0278US8152953B2Method of making printed wiring board and method of making printed circuit board unitYOSHIMURA HIDEAKI·Filed 2009·Granted Apr 10, 2012·8 cites·6 claims
- 0375US8754333B2Printed circuit board incorporating fibersYOSHIMURA HIDEAKI·Filed 2011·Granted Jun 17, 2014·4 cites·7 claims
- 0463US8119925B2Core substrate and printed wiring boardYOSHIMURA HIDEAKI·Filed 2009·Granted Feb 21, 2012·2 cites·7 claims
- 0557US8669481B2Laminated circuit board and board producing methodYOSHIMURA HIDEAKI·Filed 2011·Granted Mar 11, 2014·1 cites·3 claims
- 0651US8119923B2Circuit boardYOSHIMURA HIDEAKI·Filed 2008·Granted Feb 21, 2012·0 cites·4 claims
- 0749US8586876B2Laminated circuit board and board producing methodYOSHIMURA HIDEAKI·Filed 2011·Granted Nov 19, 2013·0 cites·13 claims
- 0845US2012211270A1Method of manufacturing printed wiring board and printed wiring boardYOSHIMURA HIDEAKI·Filed 2012·Application pending·0 cites
- 0944US2011303444A1Laminated circuit board, bonding sheet, laminated-circuit-board producing method, and bonding -sheet producing methodYOSHIMURA HIDEAKI·Filed 2011·Application pending·0 cites
- 1043US2012024586A1Printed wiring board, method for manufacturing the same, and electronic equipmentYOSHIMURA HIDEAKI·Filed 2011·Application pending·0 cites
- 1140US2012325533A1Method of manufacturing multilayer circuit board and multilayer circuit boardYOSHIMURA HIDEAKI·Filed 2012·Application pending·0 cites
- 1233US2012132464A1Method for manufacturing printed wiring board, printed wiring board, and electronic deviceYOSHIMURA HIDEAKI·Filed 2011·Application pending·0 cites
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