Assignee
YOUN HAN-SHIN
KR·1 granted patent·1 pending application·0 citations·filing 2005–2011
Technology mixH10W2
Top patents by PatentIndex Score
2 records- 0140US8278154B2Method of fabricating a semiconductor device package including a heat radiation plateYOUN HAN-SHIN·Filed 2011·Granted Oct 2, 2012·0 cites·9 claims
- 0232US2006097377A1Flip chip bonding structure using non-conductive adhesive and related fabrication methodYOUN HAN-SHIN·Filed 2005·Application pending·0 cites
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