Assignee
YOW KAI YUN
MY·7 granted patents·3 pending applications·37 citations·filing 2009–2014
Top patents by PatentIndex Score
10 records- 0192US8501517B1Method of assembling pressure sensor deviceYOW KAI YUN·Filed 2012·Granted Aug 6, 2013·21 cites·17 claims
- 0279US9165855B1Semiconductor device with die attached heat spreaderYOW KAI YUN·Filed 2014·Granted Oct 20, 2015·5 cites·7 claims
- 0370US8836091B1Lead frame for semiconductor package with enhanced stress reliefYOW KAI YUN·Filed 2013·Granted Sep 16, 2014·3 cites·18 claims
- 0470US8643169B2Semiconductor sensor device with over-molded lidYOW KAI YUN·Filed 2011·Granted Feb 4, 2014·3 cites·6 claims
- 0564US8078353B2Self monitoring braking system for vehiclesYOW KAI YUN·Filed 2009·Granted Dec 13, 2011·3 cites·20 claims
- 0660US9437492B2Substrate for alternative semiconductor die configurationsYOW KAI YUN·Filed 2014·Granted Sep 6, 2016·1 cites·8 claims
- 0759US9196576B2Semiconductor package with stress relief and heat spreaderYOW KAI YUN·Filed 2014·Granted Nov 24, 2015·1 cites·7 claims
- 0842US2015054099A1Pressure sensor device and assembly methodYOW KAI YUN·Filed 2013·Application pending·0 cites
- 0941US2015014793A1Pressure sensor having down-set flagYOW KAI YUN·Filed 2013·Application pending·0 cites
- 1036US2012074549A1Semiconductor device with exposed padYOW KAI YUN·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →