Assignee
YU CHEEMAN
US·2 granted patents·1 citations·filing 2009–2009
Top patents by PatentIndex Score
2 records- 0153US8110439B2Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packagesYU CHEEMAN·Filed 2009·Granted Feb 7, 2012·1 cites·10 claims
- 0250US8653653B2High density three dimensional semiconductor die packageYU CHEEMAN·Filed 2009·Granted Feb 18, 2014·0 cites·12 claims
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