Assignee
YU CHIH-KUANG
TW·7 granted patents·1 pending application·66 citations·filing 2005–2012
Top patents by PatentIndex Score
8 records- 0197US8241932B1Methods of fabricating light emitting diode packagesYU CHIH-KUANG·Filed 2011·Granted Aug 14, 2012·49 cites·20 claims
- 0292US8604491B2Wafer level photonic device die structure and method of making the sameYU CHIH-KUANG·Filed 2011·Granted Dec 10, 2013·7 cites·20 claims
- 0384US8598617B2Methods of fabricating light emitting diode packagesYU CHIH-KUANG·Filed 2012·Granted Dec 3, 2013·6 cites·20 claims
- 0471US8546924B2Package structures for integrating thermoelectric components with stacking chipsYU CHIH-KUANG·Filed 2010·Granted Oct 1, 2013·3 cites·16 claims
- 0563US8962358B2Double substrate multi-junction light emitting diode array structureYU CHIH-KUANG·Filed 2011·Granted Feb 24, 2015·1 cites·21 claims
- 0648US8222728B2Active solid heatsink device and fabricating method thereofYU CHIH-KUANG·Filed 2008·Granted Jul 17, 2012·0 cites·29 claims
- 0741US8519409B2Light emitting diode components integrated with thermoelectric devicesYU CHIH-KUANG·Filed 2010·Granted Aug 27, 2013·0 cites·20 claims
- 0840US2007012938A1Light-emitting-diode packaging structure having thermal-electric elementYU CHIH-KUANG·Filed 2005·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →