Assignee
YU JICK M
US·3 granted patents·1 pending application·5 citations·filing 2008–2013
Top patents by PatentIndex Score
4 records- 0170US8119525B2Process for selective growth of films during ECP platingYU JICK M·Filed 2008·Granted Feb 21, 2012·5 cites·20 claims
- 0242US8993434B2Methods for forming layers on a substrateYU JICK M·Filed 2011·Granted Mar 31, 2015·0 cites·19 claims
- 0341US9217197B2Methods for depositing a layer on a substrate using surface energy modulationYU JICK M·Filed 2011·Granted Dec 22, 2015·0 cites·18 claims
- 0441US2013341794A1Ultra-thin copper seed layer for electroplating into small featuresYU JICK M·Filed 2013·Application pending·0 cites
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