Assignee
YU TSUNG-YUAN
TW·4 granted patents·5 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0171US9099485B2Methods and apparatus of guard rings for wafer-level-packagingYU TSUNG-YUAN·Filed 2012·Granted Aug 4, 2015·2 cites·20 claims
- 0271US8871629B2Methods of and semiconductor devices with ball strength improvementYU TSUNG-YUAN·Filed 2011·Granted Oct 28, 2014·2 cites·20 claims
- 0363US8217499B2Structure to reduce etching residueYU TSUNG-YUAN·Filed 2010·Granted Jul 10, 2012·1 cites·19 claims
- 0448US8692378B2UBM structures for wafer level chip scale packagingYU TSUNG-YUAN·Filed 2011·Granted Apr 8, 2014·0 cites·11 claims
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