Assignee

YUN JA EUN

KR·1 granted patent·3 citations·filing 2007–2007

Technology mixH01L1 H10W1

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1 record

0157US8956914B2Integrated circuit package system with overhang dieYUN JA EUN·Filed 2007·Granted Feb 17, 2015·3 cites·16 claims

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