Individual holder
ZHANG JOHN H
US·14 granted patents·5 pending applications·82 citations·filing 2009–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
19 records- 0192US8921976B2Using backside passive elements for multilevel 3D wafers alignment applicationsZHANG JOHN H·Filed 2011·Granted Dec 30, 2014·14 cites·13 claims
- 0292US8680577B2Recessed gate field effect transistorZHANG JOHN H·Filed 2012·Granted Mar 25, 2014·13 cites·9 claims
- 0391US8569899B2Device and method for alignment of vertically stacked wafers and dieZHANG JOHN H·Filed 2009·Granted Oct 29, 2013·14 cites·17 claims
- 0487US8466560B2Dummy structures having a golden ratio and method for forming the sameZHANG JOHN H·Filed 2010·Granted Jun 18, 2013·9 cites·15 claims
- 0586US8685850B2System and method of plating conductive gate contacts on metal gates for self-aligned contact interconnectionsZHANG JOHN H·Filed 2012·Granted Apr 1, 2014·7 cites·8 claims
- 0684US8336148B2System and method for cleaning a charging wafer surfaceZHANG JOHN H·Filed 2010·Granted Dec 25, 2012·6 cites·20 claims
- 0784US8324622B2Method of repairing probe padsZHANG JOHN H·Filed 2009·Granted Dec 4, 2012·9 cites·12 claims
- 0881US8822994B2Method of repairing probe padsZHANG JOHN H·Filed 2012·Granted Sep 2, 2014·4 cites·15 claims
- 0976US9607864B2Dual medium filter for ion and particle filtering during semiconductor processingZHANG JOHN H·Filed 2012·Granted Mar 28, 2017·3 cites·18 claims
- 1070US9002493B2Endpoint detector for a semiconductor processing station and associated methodsZHANG JOHN H·Filed 2012·Granted Apr 7, 2015·2 cites·31 claims
- 1165US8992692B2Adjustable brush cleaning apparatus for semiconductor wafers and associated methodsZHANG JOHN H·Filed 2012·Granted Mar 31, 2015·1 cites·31 claims
- 1251US8603916B2CMP techniques for overlapping layer removalZHANG JOHN H·Filed 2009·Granted Dec 10, 2013·0 cites·37 claims
- 1350US8560111B2Method of determining pressure to apply to wafers during a CMPZHANG JOHN H·Filed 2009·Granted Oct 15, 2013·0 cites·16 claims
- 1450US2013072011A1Method of repairing probe padsZHANG JOHN H·Filed 2012·Application pending·0 cites
- 1546US2014080229A1Adaptive semiconductor processing using feedback from measurement devicesZHANG JOHN H·Filed 2012·Application pending·0 cites
- 1642US9254510B2Drying apparatus with exhaust control cap for semiconductor wafers and associated methodsZHANG JOHN H·Filed 2012·Granted Feb 9, 2016·0 cites·24 claims
- 1741US2014078495A1Inline metrology for attaining full wafer map of uniformity and surface chargeZHANG JOHN H·Filed 2012·Application pending·0 cites
- 1841US2014080304A1Integrated tool for semiconductor manufacturingZHANG JOHN H·Filed 2012·Application pending·0 cites
- 1936US2012122373A1Precise real time and position low pressure control of chemical mechanical polish (cmp) headZHANG JOHN H·Filed 2010·Application pending·0 cites
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