Assignee
ZHANG JOHN HONGGUANG
US·4 granted patents·27 citations·filing 2010–2011
Top patents by PatentIndex Score
4 records- 0193US8476765B2Copper interconnect structure having a graphene capZHANG JOHN HONGGUANG·Filed 2010·Granted Jul 2, 2013·24 cites·25 claims
- 0271US8564137B2System for relieving stress and improving heat management in a 3D chip stack having an array of inter-stack connectionsZHANG JOHN HONGGUANG·Filed 2010·Granted Oct 22, 2013·3 cites·50 claims
- 0351US9116319B2Photonic integrated circuit having a plurality of lensesZHANG JOHN HONGGUANG·Filed 2011·Granted Aug 25, 2015·0 cites·51 claims
- 0443US8653671B2System for relieving stress and improving heat management in a 3D chip stackZHANG JOHN HONGGUANG·Filed 2010·Granted Feb 18, 2014·0 cites·40 claims
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