Assignee
ZYCON CORP
US·11 granted patents·1,816 citations·filing 1989–1996
Top patents by PatentIndex Score
11 records- 0198US5079069ACapacitor laminate for use in capacitive printed circuit boards and methods of manufactureZYCON CORP·Filed 1989·Granted Jan 7, 1992·338 cites·27 claims
- 0297US5261153AIn situ method for forming a capacitive PCBZYCON CORP·Filed 1992·Granted Nov 16, 1993·239 cites·11 claims
- 0396US5800575AIn situ method of forming a bypass capacitor element internally within a capacitive PCBZYCON CORP·Filed 1993·Granted Sep 1, 1998·113 cites·25 claims
- 0496US5708569AAnnular circuit components coupled with printed circuit board through-holeZYCON CORP·Filed 1996·Granted Jan 13, 1998·221 cites·30 claims
- 0595US5161086ACapacitor laminate for use in capacitive printed circuit boards and methods of manufactureZYCON CORP·Filed 1992·Granted Nov 3, 1992·225 cites·18 claims
- 0695US5155655ACapacitor laminate for use in capacitive printed circuit boards and methods of manufactureZYCON CORP·Filed 1990·Granted Oct 13, 1992·247 cites·44 claims
- 0794US5466892ACircuit boards including capacitive coupling for signal transmission and methods of use and manufactureZYCON CORP·Filed 1993·Granted Nov 14, 1995·115 cites·14 claims
- 0894US5347258AAnnular resistor coupled with printed circuit board through-holeZYCON CORP·Filed 1993·Granted Sep 13, 1994·131 cites·33 claims
- 0991US5603847AAnnular circuit components coupled with printed circuit board through-holeZYCON CORP·Filed 1994·Granted Feb 18, 1997·79 cites·17 claims
- 1089US5144742AMethod of making rigid-flex printed circuit boardsZYCON CORP·Filed 1991·Granted Sep 8, 1992·78 cites·14 claims
- 1166US5064583AMethod for applying mold release coating to separator plates for molding printed circuit boardsZYCON CORP·Filed 1989·Granted Nov 12, 1991·30 cites·7 claims
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